The Third GMIF2024 Innovation Summit successfully concluded on September 27 in Shenzhen, marking a significant event for the global memory industry. Hosted by the Semiconductor Investment Alliance and Shenzhen Memory Industry Association, the summit focused on "AI Leads Memory's New Momentum," gathering top enterprises and experts from across the memory and storage value chain. The event attracted major players, including wafer manufacturers, memory controller suppliers, equipment manufacturers, and investment institutions.
AI Revolution and Memory Industry Growth
The rapid expansion of artificial intelligence (AI) is reshaping the global semiconductor landscape, increasing the demand for high-performance, large-capacity storage chips. The GMIF2024 Innovation Summit addressed how AI is driving growth in storage technologies and the need for industry-wide collaboration to unlock new opportunities.
Mr. Rixin Sun, President of the Shenzhen Memory Industry Association, highlighted the importance of collaboration across the industry chain to maintain leadership in global competition. He emphasized the summit's focus on storage media, solutions, system platforms, and testing equipment, reinforcing the need for collective innovation.
Key Industry Insights and Technological Evolution
Xiaofei Zhang, Chief Analyst at Haitong Securities, discussed how AI applications are accelerating demand for computing and storage solutions. Yimao Cai from Peking University emphasized the need for breakthroughs in memory technology, particularly as traditional methods face limits in density and efficiency.
Prasad Alluri from Micron Technology highlighted AI’s impact on consumer electronics, from smartphones to autonomous driving systems, while Yan Li from Western Digital shared insights on the evolving 3D NAND flash market and its challenges. Wallace C. Kou, President of Silicon Motion, further emphasized AI as a key driver of growth in the global memory ecosystem.
Innovations in Storage Technologies
Industry leaders also showcased advancements in storage technology, with companies like Intel, Western Digital, and Rockchip presenting new solutions designed to meet the evolving demands of AI and IoT. Sam Sun, Chairman of BIWIN Storage, noted the industry's focus on miniaturization and integration, driving innovation in testing and packaging technologies.
Haibing Xie from Intel introduced AI-enabled PCs as the next frontier in the PC industry, projecting a significant increase in AI chip shipments by 2025.
Global Memory Innovation Forum: Paving the Way for the Future
The summit concluded with discussions on cutting-edge trends, industry pain points, and opportunities for collaboration across the memory industry chain. Leading companies presented solutions to address wafer testing, product innovation, and cost reduction, further driving advancements in the global memory sector.
The GMIF Innovation Summit continues to establish itself as a premier event for the storage industry, offering a platform for collaboration, knowledge sharing, and technological innovation. As AI and memory technologies evolve, the summit serves as a key driver in shaping the future of the industry.